Transistor outline (TO) packages have created an industry standard footprint to design and manufacture instrumentation, sensors, and devices.
We provides TO packages and headers with a plating finish exact to customer specifications. These finishes include: nickel (Ni), copper (Cu), silver (Ag), and gold (Au), and combinations.
BENEFITS
- In-house design expertise in hermetic packages, material science, and industry applications
- Variety of plating materials with ability to combine for optimal performance
- Optional compression or matched seal construction based on application
- RoHS / REACH-Compliant packages
PLATING MATERIALS
- Nickel (Ni)
- Copper (Cu)
- Silver (Ag)
- Gold (Au)
- Combination of above plating materials
COMMON APPLICATIONS
- Microwave
- Optoelectronics
- Photodiodes
- Sensors and detectors
