Main application scope: Glue curing, Ink curing, paint curing
Package Dimensions: (Top view/Bottom View/ Side View/ Circuit)
Specifications:
| Parameter | Symble | Rated Value | Unit |
| DC forward current | IF | 2,000 | mA |
| Peak forward current | IFP | 3,000 | mA |
| Junction temperature | Tj | 85 | ℃ |
| Operating temperature range | Top | -30~+60 | ℃ |
| Storage temperature range | Tstg | -40~+100 | ℃ |
| Soldering temperature range | Tsol | 260℃ for 5 sec | ℃ |
| Forward voltage VG (V) | Peak Wavelength(nm) | Radiation flux Φe (mW) | |
| 24.0-26.0 | 365-370 | 20,000-22,000 | |
| 26.0-28.0 | 380-420 | 22,000-24,000 | |
| 28.0-30.0 | 24,000-26,000 | ||
| 30.0-30.2 | 26,000-28,000 | ||
| 28,000-30,000 |
Notes:
- Absolute Maximum Ratings Ta=25℃
- Radiation flux measured with an integrated sphere: ±10%
- Forward voltage measurement tolerance: ±3%
- The technical metrics detailed above represent test values obtained at a 120-degree beam angle.
- Pad ① is the negative pole of UVA, pad ② is the positive pole of UVA, pad ③ is the heat dissipation pad.