Main Application scope: Glue curing, Ink curing, Paint curing
Package Dimensions: (Top view/Bottom View/ Side View/ Circuit)
Specifications:
| Parameter | Symble | Rated Value | Unit |
| DC forward current | IF | 1,000 | mA |
| Peak forward current | IFP | 1,500 | mA |
| Junction temperature | Tj | 85 | ℃ |
| Operating temperature range | Top | -30~+60 | ℃ |
| Storage temperature range | Tstg | -40~+100 | ℃ |
| Soldering temperature range | Tsol | 260℃ for 5 sec | ℃ |
| Peak Wavelength(nm) | Forward voltage VG (V) | Forward voltage VG (V) | Radiation flux Φe (mW) |
| 365-370 | 12.0-12.4 | 14.0-14.4 | 4,500-5,000 |
| 380-420 | 12.4-12.8 | 14.4-14.8 | 5,000-5,500 |
| 12.8-13.2 | 14.8-15.2 | 5,500-6,000 | |
| 13.2-13.6 | 15.2-15.6 | 6,000-6,500 | |
| 13.6-14.0 | 15.6-16.0 | 6,500-7,000 | |
| 7,000-7,500 | |||
| 7,500-8,000 |
Notes:
- Absolute Maximum Ratings Ta=25℃
- Radiation flux measured with an integrated sphere: ±10%
- Forward voltage measurement tolerance: ±3%
- The technical metrics detailed above represent test values obtained at a 60-degree beam angle, with the product line available in multiple optical angles and standard 6868/7070 package dimensions.
- Pad ① is the negative pole of UVA, pad ② is the positive pole of UVA, pad ③ is the heat dissipation pad.