Main Application scope: Glue curing, Ink curing, Paint curing
Package Dimensions: (Top view/Bottom View/ Side View/ Circuit)
Specifications:
| Parameter | Symbol | Rated Value | Unit |
| DC forward current | IF | 3,000 | mA |
| Peak forward current | IFP | 5,000 | mA |
| Junction temperature | Tj | 125 | ℃ |
| Operating temperature range | Top | -30~+60 | ℃ |
| Storage temperature range | Tstg | -40~+85 | ℃ |
| Soldering temperature range | Tsol | 280℃ for 5 sec | ℃ |
| Forward voltage VG (V) | Radiation flux Φe (mW) | Peak Wavelength(nm) | Radiation flux Φe (mW) |
| 3.5-3.6 | 3,600-4,000 | 365-370 | 5,600-6,000 |
| 3.6-3.7 | 4,000-4,400 | 380-400 | |
| 3.7-3.8 | 4,400-4,800 | ||
| 3.8-3.9 | 4,800-5,200 | ||
| 3.9-4.0 | 5,200-5,600 |
Notes:
- Absolute Maximum Ratings Ta=25℃
- Radiation flux measured with an integrated sphere: ±10%
- Forward voltage measurement tolerance: ±3%
- The technical metrics detailed above represent test values obtained at a 60-degree beam angle. This product can be selected from various angles.
- Pad ① is the negative pole of UVA, pad ② is the positive pole of UVA, pad ③ is the heat dissipation pad.