Main Application scope: Glue curing, Ink curing, Paint curing
Package Dimensions: (Top view/Bottom View/ Side View/ Circuit)
Specifications:
| Parameter | Symbol | Rated Value | Unit |
| DC forward current | IF | 700 | mA |
| Peak forward current | IFP | 1,000 | mA |
| Junction temperature | Tj | 85 | ℃ |
| Operating temperature range | Top | -30~+60 | ℃ |
| Storage temperature range | Tstg | -40~+100 | ℃ |
| Soldering temperature range | Tsol | 260℃ for 5 sec | ℃ |
| Forward voltage VG (V) | Forward voltage VG (V) | Peak Wavelength(nm) | Radiation flux Φe (mW) |
| 3.5-3.6 | 3.0-3.1 | 365-370 | 600-800 |
| 3.6-3.7 | 3.1-3.2 | 380-420 | 800-1,000 |
| 3.7-3.8 | 3.2-3.3 | 1,000-1,200 | |
| 3.8-3.9 | 3.3-3.4 | 1,200-1,400 | |
| 3.9-4.0 | 3.4-3.5 |
Notes:
- Absolute Maximum Ratings Ta=25℃
- Radiation flux measured with an integrated sphere: ±10%
- Forward voltage measurement tolerance: ±3%
- The technical metrics detailed above represent test values obtained at a 60-degree beam angle. This product can be selected from various angles.
- Pad ① is the negative pole of UVA, pad ② is the positive pole of UVA, pad ③ is the heat dissipation pad.