Main Application scope: Glue curing, Ink curing, Paint curing
Package Dimensions: (Top view/Bottom View/ Side View/ Circuit)
Specifications:
| Parameter | Symbol | Rated Value | Unit |
| DC forward current | IF | 350 | mA |
| Peak forward current | IFP | 500 | mA |
| Junction temperature | Tj | 125 | ℃ |
| Operating temperature range | Top | -30~+60 | ℃ |
| Storage temperature range | Tstg | -40~+100 | ℃ |
| Soldering temperature range | Tsol | 280℃ for 5 sec | ℃ |
| Forward voltage VG (V) | Radiation flux Φe (mW) | Peak Wavelength(nm) | Radiation flux Φe (mW) |
| 3.5-4.0 | 30-35 | 335-340 | 50-55 |
| 4.0-4.5 | 35-40 | 340-345 | 55-60 |
| 4.5-500 | 40-45 | ||
| 45-50 |
Notes:
- Absolute Maximum Ratings Ta=25℃
- Radiation flux measured with an integrated sphere: ±10%
- Forward voltage measurement tolerance: ±3%
- The technical metrics detailed above represent test values obtained at a 60-degree beam angle. This product can be selected from various angles.
- Pad ① is the negative pole of UVA, pad ② is the positive pole of UVA, pad ③ is the heat dissipation pad.