Main Application scope: Glue curing, Ink curing, Paint curing
Package Dimensions: (Top view/Bottom View/ Side View/ Circuit)
Specifications:
| Parameter | Symbol | Rated Value | Unit |
| DC forward current | IF | 2,800 | mA |
| Peak forward current | IFP | 4,000 | mA |
| Junction temperature | Tj | 120 | ℃ |
| Operating temperature range | Top | -40~+60 | ℃ |
| Storage temperature range | Tstg | -40~+100 | ℃ |
| Soldering temperature range | Tsol | 260℃ for 5 sec | ℃ |
| Forward voltage VG (V) | Peak Wavelength(nm) | Radiation flux Φe (mW) | |
| 26-28 | 365-370 | 30,000-35,000 | |
| 28-30 | 385-410 | 35,000-40,000 | |
| 30-32 | 40,000-45,000 | ||
| 32-34 | 45,000-50,000 |
Notes:
- Absolute Maximum Ratings Ta=25℃
- Radiation flux measured with an integrated sphere: ±10%
- Forward voltage measurement tolerance: ±3%
- The technical metrics detailed above represent test values obtained at a 120-degree beam angle. This product can be selected from various angles.
- Pad ① is the positive pole of UVA, pad ② is the negative pole of UVA, pad ③ is the heat dissipation pad.