Optical Communication

2.5Gbps InGaAs APD Photodiode Chip

Front-illuminated planar bare chip structure with non-coplanar P/N electrodes, offering high bandwidth, high responsivity, and high reliability.

  • Features: 50μm active area, high responsivity, low dark current, 2.5GHz bandwidth.
  • Applications: Fiber optic communications; OTDR instruments/modules; ONUs, scanning imagers.

Technical Specification:

Model:0VQT-CA50
Technical Spec.SymbolTest ConditionsMinStd.MaxUnit
 ResponsivityRe1550nm,M=10.91.0  A/W
1310nm,M=10.8  
Multiplication factorMVR=VB-3V10  /
Maximum GainMmaxV=Ve-1V20  /
Reverse breakdown voltageVRlr=10μA, no illumination36 55V
Dark CurrentIoVR=VBr-3V  10nA
CapacitanceCVs-3V     f=1MHz  0.5pF
-3dB Bandwidthf3dBM=102.53.0 GHz
Temperature coefficient of breakdown voltageη-40℃~+20℃,I=10μA0.13 0.17 V/℃

Absolute Maximum Ratings:

Operating TemperatureStorage TemperatureForward CurrentReverse CurrentESD Sensitivity
-40°C to +85°C-50°C to +100°C5mA3mA≥ 300V

Reliability: Complies with Telcordia GR-468-CORE.

10Gbps InGaAs APD Photodiode Chip

The 10Gbps APD chip features a front-illuminated mesa structure with a photosensitive area diameter of 40 µm. It offers high bandwidth, high responsivity, and high reliability, meeting the requirements for 10Gbps data communication rates.

  • Feature: High-bandwidth, high-sensitivity; P-N junction with planar electrodes; High reliability
  • Applications: 10Gbps transceivers; 10G PON; 5G Fronthaul.

Technical Specification:

Model:OVQT-CA40
Technical Spec.SymbolTest ConditionsMinStd.MaxUnit
Reverse breakdown voltageVgRlp=10μA, no illumination283741V
Dark CurrentloVR=V BR-3V 1020nA
 3dB Bandwidth f₃dBM=1067 GHz
M=358 GHz
ResponsivityRe1550nm,1μW,M=10.750.8 A/W
Photocurrent gainM1550nm,lμw,VBR-3V910  
Temperature coefficient of breakdown voltageη40℃~+85℃,Ig=10μA –0.03V/℃
CapacitanceCVR=0.9VgR 0.240.30pF

Absolute Maximum Ratings:

Operating TemperatureStorage TemperatureForward CurrentReverse CurrentESD Sensitivity
-40°C to +85°C-50°C to +100°C3mA5mA≥ 250V

Reliability: Complies with Telcordia GR-468-CORE.

25Gbps InGaAs APD Photodiode Chip

The 25Gbps APD chip features a front-illuminated mesa structure with a photosensitive area diameter of 16 µm. It offers high bandwidth, high responsivity, and high reliability, meeting the requirements for 25Gbps data communication rates.

  • Feature: High-bandwidth, high-sensitivity; P-N junction with planar electrodes; High reliability
  • Applications: 25Gbps transceivers; 25G PON/25G ER; 5G Fronthaul.

Technical Specification:

Model:0VQT-CA16
Technical Spec.SymbolTest ConditionsMinStd.MaxUnit
Reverse breakdown voltageVBRIR=10μA,无光照202729V
Dark CurrentlpVR=0.9VBR 2050nA
3dB Bandwidthf₃dBVR=Vgg-2V16  GHz
ResponsivityRe1550nm,1μW,M=10.700.80 A/W
Photocurrent gainMVR=Vgr-2V6   
Temperature coefficient of breakdown voltagen40℃~+85℃,Ig=10μA,  0.03V/℃
CapacitanceCVR=0.9VBR 0.10 pF

Absolute Maximum Ratings:

Operating TemperatureStorage TemperatureForward CurrentReverse Current
-40°C to +85°C-50°C to +100°C2mA2mA

Reliability: Complies with Telcordia GR-468-CORE.

25Gbps InGaAs PIN Photodiode Chip

The 25Gbps PIN chip features top-side illumination with an optical aperture of 20 μm. It offers high bandwidth, high responsivity, and high reliability, meeting the requirements for 25Gbps data communication rates.

  • Feature: High-bandwidth, high-sensitivity; P-N junction with planar electrodes; High reliability
  • Applications: 25Gbps transceivers; 25G Ethernet/SONET

Technical Specification:

Model:0VQT-CP20
Technical Spec.SymbolTest ConditionsMinStd.MaxUnit
Reverse breakdown voltageVBRIr=10μA,无光照15– V
Dark CurrentloVR=5V 15nA
3dB Bandwidthf₃deVR=-5V18– GHz
ResponsivityR。1550nm,1μW,M=10.70.75 A/W
CapacitanceCVR=-5V 0.10 pF

Absolute Maximum Ratings:

Operating TemperatureStorage TemperatureForward CurrentReverse Current
-40°C to +85°C-50°C to +100°C2mA2mA

Reliability: Complies with Telcordia GR-468-CORE.